FCMS
   Implement

Process Summary

Coat first Spheron layer (Spheron1), expose, develop, and cure.

Coat first Spheron layer (Spheron1), expose, develop, and cure.

Sputter metal redistribution layer. Pattern and etch to form redistribution runners.

Sputter metal redistribution layer. Pattern and etch to form redistribution runners.

Coat second Spheron layer (Spheron2), expose, develop, and cross-link.

Coat second Spheron layer (Spheron2), expose, develop, and cross-link.

Deposit and pattern three layer UBM (Al/NiV/Cu).

Deposit and pattern three layer UBM (Al/NiV/Cu).

Attach pre-formed solder ball.

Attach pre-formed solder ball.

Reflow Solder

Reflow Solder