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EliteFC™

Our Elite FC™ process is the process to use when you need to place small bumps (less than 135µm) directly on the die I/O. Pitch capabilities in this process are 200µm or greater for a peripheral I/O design and 250µm or greater for a full array I/O design. Typically, the number of bumps per die ranges from 4 to 2000. The Elite FC™ process uses premixed solder paste for the solder bumps. This provides for outstanding control of the alloy composition across the entire wafer. Since the process is not limited to the bi-metal restraints of an electroplating process, tri-metal alloys (such as Sn/Ag/Cu) require nothing more than the selection of the proper tube of pre-mixed solder paste. As with all die processed with small bumps, these die will require the use of underfill during packaging. To take advantage of this process flow, the device must meet some minimum I/O pad requirements (described below). If you are looking for bump heights greater than 135µm, take a look at the Elite CSP™ flow. The Elite FC™ process requires the fewest process steps of any solder bump flow that FCMS offers.