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EliteUBM®
Our Elite UBM ™ process is the process to use when you just need to deposit a final layer of electroless Ni/Au UBM directly on the die I/O. The Elite UBM™ pad is a Ni/Au pad ranging in height from 5 microns to >30 microns. Low cost RFID tags are one of the typical applications for Elite UBM™.
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