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Backgrind

When wafer thinning is required, FCMS provides high volume backgrind processing capability.

  • The wafer backgrind process is fully automated – with cassette to cassette load/unload up to 8 inch wafer diameter.
  • The backgrind process is dual spindle with coarse and fine grinding steps.
  • Bumped and non Bumped wafers can be thinned.
  • A variety of clean, non residue tapes are available including UV.

The grind capability is:

  • 6 and 8 inch wafers
    • Non Bump – final thickness of 6 mils or 150 microns
    • Bumped – 100 micron bump height – final thickness of 10 mils or 250 microns
    • Bumped – 240 micron bump height – final thickness of 14 mils or 350 microns

The wafer backside surface roughness is:

  • R avg = .010 to .012 microns
  • R max = .103 to .123 microns

Click on the "How to Get Started" link to complete the necessary information required to start an order