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Our HistoryFlipChip Millennium (Shanghai) Co., Ltd. (FCMS) was formed as a Chinese Joint Venture company in June 2006. FCMS is a 50:50 joint venture between FlipChip International, LLC (FCI) and Millennium Microtech (Shanghai) Co., Ltd. (MMS). FCMS was the first merchant wafer bumping facility in China to utilize extensive licensed technology from FlipChip International, including wafer bumping technology used in mass production by FCI Licensees ASE, SPIL, STATS ChipPac, and Amkor. With the implementation of these technologies and additional new proprietary technology from FCI, FCMS is poised to become the premier merchant bumping facility in Shanghai, China. FCMS offers full turn key services to their customers from wafer bumping to dicing tape and reel through a service agreement with its Shanghai partner MMS. FCMS celebrated the completion of their new Shanghai facility and the start of customer qualifications in March 2007, only nine months after the formation of the company. Initial production was launched using an advanced electroless Ni/Au process, utilizing state of the art process control technology. The launch included FCI's EliteUBM TM , EliteFC TM , and EliteCSP TM processes with customer qualifications immediately started for all process groups. |
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