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FCMS
The World's Bumping Standard
Wafer Level Services

FlipChip Millennium Shanghai is dedicated to providing world class merchant bumping services through its new facility in Shanghai China. Services include: EliteUBM TM , EliteFC TM , and EliteCSP TM . This family of services is based on a highly reliable, low cost, electroless Ni/Au UBM. FCMS provides turn-key services through a partnership with Millennium Microtech Shanghai, meeting the needs of engineering prototypes to high volume manufacturing.

Die Level Services

FlipChip Millennium Shanghai provides seamless turn-key back-end services through a partnership with Millennium Microtech Shanghai (MMS). The MMS facility is located adjacent to the new FCMS facility in Shanghai. Services include: Wafer Probe, Dicing, Optical Inspection, Pick-and Place, Waffle-Pak, and Tape & Reel.